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VENDOR: Team
Full frame 120° ultra wide angle lighting Built-in Force Flow RGB lighting effect Aluminum alloy heat spreader with asymmetric minimalist design Supports ASUS Aura Sync software synchronization Latest JEDEC RC 2.0 PCB Energy saving 1.2V~1.4V ultra low working voltage Supports...
VENDOR: Team T Force
Full frame 120° ultra wide angle lighting Built-in Force Flow RGB lighting effect Aluminum alloy heat spreader with asymmetric minimalist design Supports ASUS Aura Sync software synchronization Latest JEDEC RC 2.0 PCB Energy saving 1.2V~1.4V ultra low working voltage Supports...
VENDOR: Team
Full frame 120° ultra wide angle lighting Built-in Force Flow RGB lighting effect Aluminum alloy heat spreader with asymmetric minimalist design Supports ASUS Aura Sync software synchronization Latest JEDEC RC 2.0 PCB Energy saving 1.2V~1.4V ultra low working voltage Supports...
VENDOR: Team
Full frame 120° ultra wide angle lighting Built-in Force Flow RGB lighting effect Aluminum alloy heat spreader with asymmetric minimalist design Supports ASUS Aura Sync software synchronization Latest JEDEC RC 2.0 PCB Energy saving 1.2V~1.4V ultra low working voltage Supports...
VENDOR: Team
RGB Colors & 120° Ultra-Wide Lighting Supports Intel XMP3.0 for One-Click Overclocking Power Management ICs (PMIC) Equipped for Stable, Efficient Power Usage Strengthened PMIC Cooling Design On-die ECC for Stable System High-Quality ICs Selected for Stability & Reliability Equipped with...
VENDOR: Team
RGB Colors & 120° Ultra-Wide Lighting Supports Intel XMP3.0 for One-Click Overclocking Power Management ICs (PMIC) Equipped for Stable, Efficient Power Usage Strengthened PMIC Cooling Design On-die ECC for Stable System High-Quality ICs Selected for Stability & Reliability Equipped with...
VENDOR: Team
RGB Colors & 120° Ultra-Wide Lighting Supports Intel XMP3.0 for One-Click Overclocking Power Management ICs (PMIC) Equipped for Stable, Efficient Power Usage Strengthened PMIC Cooling Design On-die ECC for Stable System High-Quality ICs Selected for Stability & Reliability Equipped with...
VENDOR: Team
Top choice for STEAM Deck capacity upgrade Top choice for capacity upgrade on lightweight devices Heat dissipating graphene label for enhanced heat dissipation and system operating stability Gen4 read/write speed compatible with PCIe Gen3 interface Small-size and High Performance 22x30mm...
VENDOR: Team
3D NAND best upgrade option for gaming Enhanced performance for seamless cutscenes Smart optimization to ensure reliable performance Shock-resistant, vibration-resistant, and reduced noise interference
VENDOR: Team
3D NAND best upgrade option for gaming Enhanced performance for seamless cutscenes Smart optimization to ensure reliable performance Shock-resistant, vibration-resistant, and reduced noise interference
VENDOR: Team
3D NAND best upgrade option for gaming Enhanced performance for seamless cutscenes Smart optimization to ensure reliable performance Shock-resistant, vibration-resistant, and reduced noise interference
VENDOR: Team
3D NAND best upgrade option for gaming Enhanced performance for seamless cutscenes Smart optimization to ensure reliable performance Shock-resistant, vibration-resistant, and reduced noise interference